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In the early 2000s, test compression evolved from being an area of mostly academic interest to an important DFT market segment. Since that time, there has been an explosion of interest in the area, which has led to several researchers and companies creating new compression methods and products. These new methods have been synergistic with the need for additional tests to detect the defects being discovered in nanometer designs, including transition, path delay, and bridging faults. Such tests are expensive in terms of vector counts, and compression represents an opportunity to add more vectors while continuing to use existing ATE. IEEE Design & Test seeks original manuscripts for a special issue on the current state of test compression, scheduled for publication in March-April 2008. This special issue constitutes an attempt to take a snapshot of our progress in test compression. We invite submissions of unpublished, original articles that give the state of the art on compression techniques, a historical perspective on compression, the use of compression in testing for defects in nanometer designs, or perspectives on the future of compression. Topics of interest include, but are not restricted to, the following areas:
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Submission and Review Procedures | |||
Prospective authors should follow the submission guidelines for IEEE Design & Test. All manuscripts must be submitted electronically to the IEEE Manuscript Central Web site at https://mc.manuscriptcentral.com/cs-ieee. Indicate that you are submitting your article to the special issue on “The Current State of Test Compression.” All papers will undergo the standard IEEE Design & Test review process. Submitted manuscripts must not have been previously published or currently submitted for publication elsewhere. Manuscripts must not exceed 5,000 words, including figures (with each average-size figure counting as 150 words) and including a maximum of 12 References (50 for surveys). This amounts to about 4,200 words of text and five figures. Accepted articles will be edited for clarity, structure, conciseness, grammar, passive to active voice, logical organization, readability, and adherence to style. Please see IEEE D&T Author Resources at http://www.computer.org/dt/author.htm, then scroll down and click on Author Center for submission guidelines and requirements. Schedule
Questions Please direct questions regarding this special issue to Guest Editors. Guest Editors:
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